常用编码X1G006001007914是一款高精密的5G无线模块温补晶振
来源:http://www.konuaer.net 作者:jiss 2022年09月24
常用编码X1G006001007914是一款高精密的5G无线模块温补晶振,EPSON爱普生公司之所以能够快速占领市场,并成为目前全球最大的有源晶振供应商,一直走在技术的最领先的位置,技术方面能力无人可超越,爱普生晶振所生产出来的产品可谓达到鬼斧神工,以高标准高要求严格化要求自身,产品覆盖石英材料、基座及精微化、高精度、高品质频率产品。
爱普生晶振利用自身的优势开发出了新颖的TG-5510CA晶振,编码X1G006001007914,频率24.000000兆赫,输出剪波正弦波,电源电压3.13 ~ 3.46 V,电源电压(一般)3.300 V,尺寸(LxWxH)7.0 x 5.0 x 1.5 mm,操作温度-40至+85°C,频率公差+/- 1.0 ppm,TG-5510CA是一种高稳定性TCXO温补晶振可与任何一种CMOS或裁剪正弦输出,5G基站和边缘计算可调至+85℃,需要户外安装,小型化和无风扇操作,与其他tcxo相比,它提供了各种改进,如由于低温的坡度和相位噪声,符合GR-1244-CORE Stratum3和G.8262.1, G.8273.2 (A类,B类),非常适合用于5G无线模块,智能家居,投影仪等领域。
贴片温补晶振 | Model | Frequency | LxWxH | Output Wave | Supply Voltage | F.Tol@25°C | Ope Temperature |
X1G006011009414 | TG-5511CA | 12.800000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006011009514 | TG-5511CA | 20.000000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006011009614 | TG-5511CA | 38.880000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006011009714 | TG-5511CA | 50.000000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006011009814 | TG-5511CA | 10.000000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006011020314 | TG-5511CA | 50.000000 MHz | 7.00 x 5.00 x 1.50 mm | Clipped sine wave | 3.135 to 3.465 V | +/-1.0 ppm | -40 to +85 °C |
X1G006001004114 | TG-5510CA | 10.000000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to +105 °C |
X1G006001004214 | TG-5510CA | 19.200000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to +105 °C |
X1G006001004314 | TG-5510CA | 20.000000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to +105 °C |
X1G006001004414 | TG-5510CA | 24.576000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to +105 °C |
X1G006001004514 | TG-5510CA | 25.000000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to +105 °C |
X1G006001004614 | TG-5510CA | 38.880000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to +105 °C |
X1G006001004714 | TG-5510CA | 40.000000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to +105 °C |
X1G006001004814 | TG-5510CA | 50.000000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to +105 °C |
X1G006001007614 | TG-5510CA | 30.720000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006001007714 | TG-5510CA | 24.576000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006001007814 | TG-5510CA | 49.152000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006001007914 | TG-5510CA | 24.000000 MHz | 7.00 x 5.00 x 1.50 mm | Clipped sine wave | 3.135 to 3.465 V | +/-1.0 ppm | -40 to +85 °C |
X1G006001008014 | TG-5510CA | 48.000000 MHz | 7.00 x 5.00 x 1.50 mm | Clipped sine wave | 3.135 to 3.465 V | +/-1.0 ppm | -40 to +85 °C |
X1G006001008114 | TG-5510CA | 19.200000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006001008214 | TG-5510CA | 38.400000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006001008314 | TG-5510CA | 27.000000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to +85 °C |
X1G006001009014 | TG-5510CA | 25.000000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006001009114 | TG-5510CA | 19.440000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006001009214 | TG-5510CA | 25.600000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006001009314 | TG-5510CA | 40.000000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006001009414 | TG-5510CA | 12.800000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006001009514 | TG-5510CA | 20.000000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006001009614 | TG-5510CA | 38.880000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006001009714 | TG-5510CA | 50.000000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
X1G006001009814 | TG-5510CA | 10.000000 MHz | 7.00 x 5.00 x 1.50 mm | CMOS | 3.135 to 3.465 V | +/-1.0 ppm | -40 to ++85 °C |
常用编码X1G006001007914是一款高精密的5G无线模块温补晶振,有源晶振是将晶体谐振器和相关功能电路集成封装在一起,完成特定功能的模块,应用在手机蓝牙、USB及工控类IC时钟信号等对工艺稳定性要求较高的领域。
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此文关键字: 贴片温补晶振
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